These days, details about Xiaomi 11 are unsealed gradually. Some bloggers also shared the disassembly of Xiaomi 11. Here are some details that cannot be missed.

1. Both Snapdragon 888 and flash memory are sealed with glue, which can further enhance the safety of the mobile phone when it falls or gets into water.

2. The main camera CMOS comes in Samsung HMX, the macro is Samsung S5K5E9, the front is Samsung S5K3T2, and the ultra wide angle is OV13B10, no Sony solution is applied.

3. The main camera glass cover adopts the same CNC integrated processing as iPhone, and the macro lens directly uses the cover glass, which puts forward higher requirements for the optical performance and flatness of the glass cover, and the processing difficulty of the response is also higher.

4. Heat dissipation, VC hot plates are all covered in motherboard, and the use of copper foil, graphite, silicone grease, aerogels and other materials is not stingy.

5. In order to reduce the chance of false touch of curved screen, a new grip sensor is added in Xiaomi 11, which combines hardware with software.

6. In terms of the temperature control of the fuselage, the performance of plain leather and glass version is the same, HDR HD 60Hz eat chicken for half an hour, the maximum front is about 41 degrees, the maximum back is about 40 degrees.

The heat of Snapdragon 888 itself is very worthy. After a blogger tried to remove all the heat dissipation materials such as copper foil and metal shield, he found that this SOC can easily touch more than 80 degrees.